Multichip Packages

          Get critical features and functions to maximize your design — high performance, high quality, power efficiency, wide density ranges, small package sizes, industrial temperature ranges and more — from our broad portfolio of industry-standard multichip packages (MCPs).

          By Technology

          View part catalogs, download data sheets, and find other product information.
          e.MMC-Based MCP
          Quick look
          Benefits
          • Embedded managed NAND and High Performance LPDRAM in a single package
          • Simplified software solutions for complex high density NAND applications
          • Technology
            e.MMC, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
          • Densities
            e.MMC: 4GB–32GB; LPDRAM: 4Gb–48Gb
          • Package
            WFBGA, VFBGA, TFBGA, POP
          UFS-Based MCP (uMCP)
          Quick look
          Benefits
          • Embedded managed NAND and high-performance LPDRAM in a single package.
          • Enables high-density, low-power storage in a small footprint.
          • Technology
            LPDDR4 SDRAM, LPDDR4X SDRAM, UFS 3D NAND
          • Densities
            UFS: 32GB; LPDRAM: 24Gb (3GB)
          • Package
            WFBGA
          NAND-Based MCP
          Quick look
          Benefits
          • Offers high densities for data-intensive applications
          • Provides high speeds, with x8, x16 and x32 bus widths
          • Enables high reliability with SLC NAND that provides up to 100,000 PROGRAM/ERASE cycles
          • Technology
            LPDDR SDRAM, LPDDR2 SDRAM, LPDDR3 SDRAM, LPDDR4 SDRAM
          • Densities
            NAND: 1Gb - 8Gb
          • Package
            WFBGA, VFBGA, TFBGA, POP
          NOR-Based MCP
          Quick look
          Benefits
          • Simplifies design while speeding performance for low-density applications
          • Reduces active ball count by more than 50% thanks to shared-bus and A/D MUX options
          • Speeds boot-up and extends battery life with execute-in-place (XIP) functionality
          • Supports low-voltage applications (1.8V)
          • NOR Densities
            32Mb - 512Mb
          • Voltage
            1.8V
          • Package
            TFBGA, VFBGA
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